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A High Isolation Series-Shunt RF MEMS Switch

机译:高隔离度串联-并联RF MEMS开关

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摘要

This paper presents a wide band compact high isolation microelectromechanical systems (MEMS) switch implemented on a coplanar waveguide (CPW) with three ohmic switch cells, which is based on the series-shunt switch design. The ohmic switch shows a low intrinsic loss of 0.1 dB and an isolation of 24.8 dB at 6 GHz. The measured average pull-in voltage is 28 V and switching time is 47 μs. In order to shorten design period of the high isolation switch, a structure-based small-signal model for the 3-port ohmic MEMS switch is developed and parameters are extracted from the measured results. Then a high isolation switch has been developed where each 3-port ohmic MEMS switch is closely located. The agreement of the measured and modeled radio frequency (RF) performance demonstrates the validity of the electrical equivalent model. Measurements of the series-shunt switch indicate an outstanding isolation of more than 40 dB and a low insertion loss of 0.35 dB from DC to 12 GHz with total chip size of 1 mm × 1.2 mm.
机译:本文提出了一种基于串联分流开关设计的,在具有三个欧姆开关单元的共面波导(CPW)上实现的宽带紧凑型高隔离微机电系统(MEMS)开关。欧姆开关在6 GHz时显示出0.1 dB的低固有损耗和24.8 dB的隔离度。测得的平均吸合电压为28 V,开关时间为47μs。为了缩短高隔离开关的设计周期,开发了基于结构的三端口欧姆MEMS开关小信号模型,并从测量结果中提取了参数。然后,开发出了一个高隔离度开关,每个3端口欧姆MEMS开关都紧靠其中。测量和建模的射频(RF)性能的一致性证明了电气等效模型的有效性。串联分流开关的测量结果表明,从DC到12 GHz的隔离度高达40 dB以上,插入损耗仅为0.35 dB,芯片总尺寸为1 mm×1.2 mm。

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